Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Developments and Applications for Thermal Core PCBs|
|Keywords: Thermal Core, PCB, Developments|
|A description will be given of developments, requirements, and applications for multilayer organic printed circuit boards containing thermal control layers which provide high in-plane thermal conductivity, high through-plane thermal conductivity, and the ability to offer selected CTE values tailored to (GaN RF, SiC, Si) device CTE requirements. Trends in design, new developments intended to meet specific requirements for RF and other integrated and power semiconductors, and examples of applications.|
|David L Saums, Principal