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Novel Packaging Approach for Moisture Control for Electronic Systems
Keywords: Novel Adsorptive Packaging, Thermal vs Moisture control, Ingress sealing
Extending the life and reliability of electronic devices and assemblies is a function of controlling the environment around the electronics to prevent corrosion, degradation, or contamination of the components. As thermal issues continue to increase from heat sources in handheld, automotive, airborne, and outdoor electronics systems enclosures where environmental sealing or partial sealing is required, choice of package materials becomes increasingly critical. Solutions for selection of adequate package materials, adequate thermal management, and necessary moisture control in low-cost enclosures increasingly must be dealt with by product designers – and often those individual materials solutions can have contrary results between these disciplines. This presentation will cover basic concepts of environmental control (also known as active packaging) as applied to moisture, the most common cause of degradation of electronic devices and systems. The two most common approaches for preventing degradation by moisture are either sealing in a glass/metal enclosure or adding a mass of desiccant inside the somewhat permeable enclosure. Our novel approach is to make the enclosure housing from a desiccant/polymer composite to extend the active service life of an electronic device, while minimizing cost and weight typically associated with metal/glass construction. This presentation will focus on one specific marine/consumer application for illustration. The description of the application and how materials were evaluated and applied to save the problems identified will be illustrative of these principles of moisture management. This will compare ingress management (moisture) to egress management (thermal), i.e. no path in versus one path out. We will step through the process and have real data, demonstrating quite an interesting concept in that the housing has adsorptive capacity so the estimated ingress for the first two years is zero. This is similar in concept to a phase change material that is a reactive cooling technology with a certain thermal capacity; it is good for buying time and for dealing with transient spikes in heat loading. For egress, the active component must handle spikes and the capacity is 'reusable'; for ingress it must handle the 'long haul' and typically will not be reusable.
Ken Credle, Business Development Leader Electronics
Multisorb Technologies
Buffalo, NY

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