Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Non-Silicone Thermal Interface Material Development Strategy|
|Keywords: Thermal Interface Materials, TIMs, non-silicone|
|This presentation will show the methodology and strategy used in formulating non-silicone TIMs to meet the ever increasing demands for more thermal efficiency and longer useful lifetimes. It will also attempt to explain some of the terminology which is at time confusing to engineers working in the field of thermal management. Examples are provided showing how factors such as fluid filler compatibility, surfactants, and antioxidants affect the performance of non-silicone materials. The performance of non-silicone TIMs are also benchmarked against some of the better performing silicone materials which are commercially available. An important concept in the field of thermal management is difference between thermal conductivity and thermal resistance. Thermal Conductivity, KTIM = f (kf, km, Ф, Rb) kf = filler thermal conductivity km = fluid thermal conductivity Ф = filler volume fraction – MOST IMPORTANT FACTOR Rb = contact resistance – becoming increasingly important Thermal Resistance, RTIM = BLT/KTIM + Rc1 + Rc2 A thermal performance comparison of TIM materials will be made using the criteria stated above. Results obtained from test equipment such as the ASTM D 5470-06 Thermal Conductivity Tester and an Oracle model 270 7806-01 Thermal Test Vehicle, will be compared with a real-life thermal imaging method. A comparison of thermal shock stability will also be given.|
|Victor D Papanu, Vice President, Engineering
AOS Thermal Compounds LLC