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Technologies and Tools Enabling Chip-to-System Co-Design of Electronics
Keywords: Electronics Thermal Management, Thermal Simulation, Chip to System Co-Design
Thermal management of electronics spans the spectrum of handheld devices with no air cooling to rack servers in data centers. Even though methodologies needed for design can be different for each class of electronics cooling problem, proactive engineering at early stage is a common mantra widely accepted in the thermal management community. This presentation will look into the technical and practical challenges associated with implementing a wholistic thermal design approach across a supply chain spanning different companies. With the above as a motivation, the talk will introduce simulation based methodologies for implementing a chip-to-system co-design methodology. Specific topics include abstraction methods pertinent to system, board, Package and Chip. The role of compact modeling, which is an effective tool for communication across domain expertise as well as organizational boundaries will also be discussed. Most importantly, the talk will address the needs of thermal engineers interested in implementing solutions at their organization as well as beneficiaries whose success is vested in cooler, faster and user friendly end products.
Kamal Karimanal, Founding Architect
Cielution LLC
Cupertino, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems