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TIMs and Thermal Management of Packages
Keywords: TIMs, Thermal Management, Servers
Advances in device designs and packages for high-end servers, custom logic applications, consumer devices, power electronics and LEDs pose challenges in thermal management. Thermal interface materials play a critical role in package cooling objectives. Organic packages, with their associated warp and mechanical stress/strain considerations, and stacked die configurations pose additional challenges. We will review examples of addressing the thermal management of various packages, with emphasis on servers and custom logic applications, using a variety of TIMs (from thermal pastes to curable polymeric TIMs to pads) and highlight the challenges and innovative approaches to meeting the thermal objectives.
Sushumna Iruvanti, Senior Engineer
IBM Corporation
Hopewell Junction, NY

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