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Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.
Keywords: surface finish, ENEPIG, Direct Palladium
Surface Finishes on Ceramic Electronis are an important feature. The Surface Finish enables the assembly technologies on the ceramic substrate. The paper will present the possible surface finish options for Ceramic Substrates and include the advantages and challenges to each surface finish. Furthermore the paper will show 2 new Surface Finishes like direct EP and Direct EPAG. The need for these new finishes comes from needs for new assembly technologies like copper wire bonding. Furthermore Nickel is an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5µm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with Direct Gold on Copper. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.
Mustafa Özkök, Global Product Manager Surface Finishes
Atotech Germany GmbH
Berlin, Berlin

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