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Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Keywords: LTCC and Hybrid Technology, Joining by Lamination, Cofiring
In microelectronics there is a continuous trend for devices of higher integration and improved heat dissipation. Thick-film hybrid technology uses sintered ceramic substrates, mostly Al2O3, which are screen printed with functional pastes, followed by firing at 850 °C. Alumina substrates provide very good heat conductivity (25 W/mK), but there are only two sides to carry a metallization. Better miniaturization can be accomplished by multilayer systems using LTCC technology. LTCC devices are made by screen-printing, stacking and lamination ceramic green tapes, followed by co-firing. Drawback is the low heat conductivity (3 W/mK) due to their high glass content. By combining hybrid and LTCC technology the advantages of both methods like good thermal conductivity and high multilayer integration, respectively systems, can be joined. Because the failure rate is too high to laminate green tapes on sintered ceramic substrates via thermo compression, cold low pressure lamination (CLPL) has been used as an alternative lamination process. CLPL is a lamination method, where the joining of the components is performed at room temperature by application of very low pressure (<5 MPa) by using a double sided adhesive tape. During heat treatment the adhesive film keeps the tapes together until the adhesive is completely decomposed; during further temperature increase the tapes are joined by sintering. The paper describes the materials used and processing steps to join the sintered material with the green tapes and discusses effects which occur during firing. These effects like edge curl and crack formation are mainly due to stresses which occur during constrained sintering. Their control can be influenced by changing process parameters.
Michael Hambuch,
University of Erlangen-Nuremberg, Department of Materials Science, Germany
Erlangen, Bavaria
Germany


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