Micross

Abstract Preview

Here is the abstract you requested from the cicmt_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

LTCC Multilayer Modules with Integrated Functional Materials
Keywords: integration of functional materials, multilayer inductors, cofiring behavior
Ceramic multilayer boards fabricated by the low temperature ceramic cofiring (LTCC) technology are widely used in electronics and communication applications. Multilayer boards with post-fired SMD passives are increasingly replaced by more complex LTCC modules with integrated electromagnetic functions, i.e. with passive components embedded in the ceramic 3D multilayer structure. The integration of functional ceramic layers into low-dielectric LTCC multilayers requires matching of the sintering and shrinkage behaviors and minimization of the thermal expansion mismatch. Chemical compatibility is also crucial, since reactions or interdiffusion between functional and LTCC materials interferes with the functionality of the component. To ensure sufficient densification and proper microstructure formation under low-temperature co-firing conditions, sinter-active functional ceramic powders and liquid-phase sintering additives are used. We show that various functional ceramics can be embedded into multilayer boards. The cofiring behavior at 900°C of dielectric (BST, CCTO), magnetic (NiCuZn- and substituted Y- and M-type hexagonal ferrites) and NTC thermistor (NiMn spinels) tapes in combination with low-K dielectric LTCC tapes was investigated. The development of selected functional materials for multilayer ceramics will be highlighted. The application of these materials in monolithic multilayers as well as in multilayer components integrated into LTCC modules will be shown. General trends of materials compatibility and cofiring ability will be addressed.
Jörg Töpfer,
Univ. Appl. Sciences Jena, Germany
Jena, Thuringia
Germany


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems