Micross

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Integrated Magnetic Structures for High Temperature Power Electronics
Keywords: LTCC, Magnetics, High Temperature
The goal of this study is to investigate packaging techniques for extreme environment (i.e., -50 °C to 250 °C) power electronics; specifically the integration of powdered magnetic cores into three dimensional ceramic structures. By creating an embedded magnetic cores in low temperature co-fired ceramic (LTCC), gains can be made in terms of both miniaturization as well as reliability. This approach differs from other LTCC integrated magnetics, as the magnetic core is not co-fired with the rest of the substrate. Instead, a three dimensional cavity structure is created in which the core structure can be placed in after firing of the ceramic, thereby allowing for flexibility in terms of the magnetic core used. This paper will present the design and development of these three dimensional magnetic structures. A summary of three dimensional ceramic packaging approaches will be discussed, and the integrated magnetic structure prototype will be presented. Relevant electrical parameters will also be tested and discussed for these structures.
John Fraley, Lead Engineer
Arkansas Power Electronics Intl.
Fayetteville, AR
USA


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