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A Study on Reliability Test of Multilayer Chip Inductors
Keywords: endurance, plating, chip inductor
Plating conditions significantly affect the reliability of components. For example, matter exchanges between the surface of components and the plating solution due to the corrosive characteristics of the latter, and this will produce excess ions and electrons that then lead to electromigration. Reducing the plating current and shortening the plating time can inhibit the corrosion associated with the plating solution, and thus lengthen the life of components. Another approach is increasing the sintering temperature, which can enhance the resistance of the surfaces of components to the plating solution, and thus also increase their lifespan. With regard to the cause of electromigration, the electric field might come from the interaction between the magnetic field and joule heat created by the current load and ambient temperature during the testing of the component lifespan.
Wen-Hsi Lee, Prof.
Department of Electrical Engineering,National Cheng-Kung University
Tainan, Taiwan
Taiwan, ROC

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic