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|Characterization of Dense LTCC 9K7 Based Low-Impedance Via Structures up to 3GHz|
|Keywords: Power Integrity, LTCC, Characterization|
|Modern power distribution networks (PDNs) implemented in low temperature co-fired ceramic technology (LTCC) can require dense arrays of vias to achieve the low impedances associated with today’s high-current, low-voltage, and low-ripple IC power supply rails. This paper highlights techniques for verifying agreement between the complex impedance of simulated and fabricated via arrays in the early stages of PDN design. A four-wire technique is used to find DC resistance (~µΩ) as well as to observe resistive heating when a high-current (>100A) is passed through large arrays consisting of thousands of vias in parallel. Characterization up to 3GHz is performed using a test fixture consisting of SMA connections to a microstrip with the vias of interest in the shunt-through configuration. A vector network analyzer (VNA) is used to find the complex impedance of the structures. Although we are mainly interested in the transfer impedance, techniques for finding the self- and input-impedance are discussed as well. Fixture de-embedding by modeling is performed using Agilent ADS. Results from DC characterization are compared to output from Ansoft’s parasitic extractor tool Q3D. High-Frequency measurements are compared to full-wave simulation using Ansoft HFSS with and without the test fixture.|