Micross

Abstract Preview

Here is the abstract you requested from the cicmt_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Characterization of Dense LTCC 9K7 Based Low-Impedance Via Structures up to 3GHz
Keywords: Power Integrity, LTCC, Characterization
Modern power distribution networks (PDNs) implemented in low temperature co-fired ceramic technology (LTCC) can require dense arrays of vias to achieve the low impedances associated with today’s high-current, low-voltage, and low-ripple IC power supply rails. This paper highlights techniques for verifying agreement between the complex impedance of simulated and fabricated via arrays in the early stages of PDN design. A four-wire technique is used to find DC resistance (~µΩ) as well as to observe resistive heating when a high-current (>100A) is passed through large arrays consisting of thousands of vias in parallel. Characterization up to 3GHz is performed using a test fixture consisting of SMA connections to a microstrip with the vias of interest in the shunt-through configuration. A vector network analyzer (VNA) is used to find the complex impedance of the structures. Although we are mainly interested in the transfer impedance, techniques for finding the self- and input-impedance are discussed as well. Fixture de-embedding by modeling is performed using Agilent ADS. Results from DC characterization are compared to output from Ansoft’s parasitic extractor tool Q3D. High-Frequency measurements are compared to full-wave simulation using Ansoft HFSS with and without the test fixture.
Alexander Pfeiffenberger,
Auburn University
Auburn, AL
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems