Here is the abstract you requested from the cicmt_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thick Film Pastes for Power Application|
|Keywords: High power application, , thick printable thick film pastes, , Ag- and Cu-pastes for AlN, Al-oxide,|
|Thick Film Pastes for Power Application Electronic circuits made by thick film technology found their way into the electronic circuitry for automotive applications. Well established are very dense packed multi-layer hybrid circuits with its function for motor- and transition management. Since the next generation of cars like Hybrid-cars or E-cars requests materials with a much higher power density a material supplier like a paste manufacturer is faced with high reliability demands like high voltage stability and thermal dissipation. The presentation will show the steps of development for thick printable silver- and copper-based conductor pastes and a detailed description of the various test methods. Further to the collection of the physical data and pictures made by scanning microscopy helps to understand the behaviour of the sintered layers on both Al-oxide- and AlN-substrates. At the end of the challenging and time consuming development Heraeus is able to provide a full range of conductor pastes which meets the customers specification and which just in the phase to enter the market. To meet future automotive application a roadmap of products in pipeline will be discussed|
|Christina Modes, Head of R&D Heraeus Precious Metals, TFD-TH
Heraeus Precious Metals GmbH & Co. KG, TFD-TH