Here is the abstract you requested from the cicmt_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Direct printing and its application in LTCC|
|Keywords: Direct Printing, LTCC, High density|
|Microelectronic manufacturing industry has been seeking for better efficiency and quicker turn-around for decades. And the demand for higher density packaging has been increasing in recent years. Better materials and new processing techniques have been emphasized. LTCC technology has demonstrated great potential for satisfying most performance, cost and processing requirement. Micro-dispensing can print a very wide range of materials to include a variety of screen printable thick film conductors, thick film resistors, dielectric and solder. Those with experience in micro-dispensing recognize the size limitation using a dispensing approach and understand that the hope of achieving smaller line widths, smaller pad sizes, and precise placement of the material is not feasible. nScrypt has demonstrated the ability to considerably shrink the line widths and dots from traditional micro-dispensing, thus enabling the next generation packaging and increasing the component count in the same or less volume. In addition to the new and enabling reduced volume approach, nScrypt will also demonstrate how the 3D capability and speed of this approach will rival traditional high volume screen printing as well as other maskless technologies, thus making this a viable manufacturing tool for many applications for LTCC microsystem and packaging.|
|Xudong Chen, Director