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Strain Measurement and Mechanical Property Evolution in Sol-Gel PZT Thin Films
Keywords: Sol-Gel PZT, Residual Stress, Cracking
Cracking is a notorious issue with sol-gel PZT thin films, and film failure in this manner is difficult to reliably predict due to constantly evolving mechanical properties. In this work, two non-contact experimental methods are used to quantify the stiffness response of PZT sol-gel during thermal loading and the influence of solution additives, such as lactic acid and gycerol. The mechanical properties are determined using a digital image correlation method to measure strain and wafer curvature measurements to estimate bi-axial stress. Results show the transition from a compliant response to more glassy behavior. The importance of this changing stiffness is shown for a specific application of a buckled MEMS actuator and in relation to adhesion based failure modes.
Thomas A. Berfield, Assistant Professor
University of Louisville
Louisville, KY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
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  • Palomar
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  • Technic