Here is the abstract you requested from the cicmt_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Strain Measurement and Mechanical Property Evolution in Sol-Gel PZT Thin Films|
|Keywords: Sol-Gel PZT, Residual Stress, Cracking|
|Cracking is a notorious issue with sol-gel PZT thin films, and film failure in this manner is difficult to reliably predict due to constantly evolving mechanical properties. In this work, two non-contact experimental methods are used to quantify the stiffness response of PZT sol-gel during thermal loading and the influence of solution additives, such as lactic acid and gycerol. The mechanical properties are determined using a digital image correlation method to measure strain and wafer curvature measurements to estimate bi-axial stress. Results show the transition from a compliant response to more glassy behavior. The importance of this changing stiffness is shown for a specific application of a buckled MEMS actuator and in relation to adhesion based failure modes.|
|Thomas A. Berfield, Assistant Professor
University of Louisville