Micross

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Routes for LTCC to Power-electronics
Keywords: LTCC, High power requirements, Thermal Management
Ceramic mulitlayer materials are excellent insulators, providing high voltage resistivity accompanied with good thermal stability and reasonable thermal conductivity. Furthermore conductors and functional elements like resistors can be monolithically embedded into the substrate structure, thus beeing protected against humidity, corrosion and voltage flashover. Related to heat dissipation, LTCC offers manifold possibilites for optimum thermal management: from silver filled vias acting as heat pipes,to conventional heat sinks made of high thermal conductive materials up to integrated liquid cooling. LTCC offers further advantages with respect to surface modifications by embossing and by different coating technologies. Positive characteristics like this indicate, that LTCC technology potentially will play a significant role in the area of LED lighting and driving technique. If and how far LTCC is in a position to step into these markets, will depend on two questions: can typical disadvantages of thickfilm technology like low current density of printed lines and the relatively low thermal conductivity be overcome by technological innovations? And if yes, is it possible with this technology to achieve the cost structures necessary for those high volume markets? In this presentation it is shown, which ways VIA is following to overcome the technological barriers in order to get access to both of this big markets.
Franz Bechtold, Managing Director
VIA electronic GmbH
Hermsdorf, Germany
Germany


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