Device Packaging 2019

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Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
Keywords: wire bonding reliability , high temperature, vibration
The future performance requirements to be set by the aerospace electronics industry demand electronic systems to operate in extreme conditions that exceed the current levels specified by the military and aerospace standards. In high temperature and wide operating temperature applications, electronics can suffer from failure modes caused by a combination of environmental and operational loadings such as temperature, vibration, humidity, pressure, external stresses, etc. Previous research has shown that 55% of the failures related to operating environments are caused by high temperatures and temperature cycling, 20% by vibration and shock and 35% by other operating conditions [1]. However, separate environmental tests used in qualification testing by the electronics industry are not able to reveal the effects of the combined conditions on the failure modes and reliability. Previous work by the author on the combined effects of thermal and vibration loadings on wire-bonded devices has shown that when such environmental factors are combined there is an increased susceptibility of the interconnections to failure compared to single environmental tests [2] [3] [4]. This paper has extended the investigation of the combined effects of thermal and vibrational environments on wire-bonded interconnections used in high temperature electronic components. The work is focused on combined testing at temperatures up to 250°C and vibration loading with the sine frequency swept cycles ranging from 5Hz to 2000Hz and acceleration up to 20g rms. Analysis is focusing on the wire bond connections which has shown an increasing occurrence of wire breakage at a test temperature of 250°C whilst being subjected to vibration, particularly for wires with large loop shapes. Failure mechanisms have been identified through visual inspection, electrical characterization, ball shear and wire pull tests as well as microstructural characterization using a dual beam FEGSEM-Focused Ion Beam (FIB) system.
Maria Mirgkizoudi, PhD Researcher
Loughborough University
Loughborough, Leicestershire
United Kingdom

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