Abstract Preview

Here is the abstract you requested from the HiTEN_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)
Keywords: Enhanced Geothermal Systems, Directional Drilling, High Temperature Electronics
The DM300 orientation module was developed to support 300°C drilling operations in pursuit of goals established by the U.S. Department of Energy’s Enhanced Geothermal Technologies initiative. Over the past few months, the technology has been demonstrated in a prototype module at temperatures up to 300°C. This paper presents the results of the DM300 development and testing. It reports on lessons learned in implementing electronics, interconnects, packaging, and mechanical structures to successfully create an accelerometer and magnetometer sensor module to effectively guide directional drilling at temperature up to 300°C. The DM300 module provides for three axis measurement of the Earth’s magnetic and gravity vectors to determine the inclination angle, tool face angle, and heading azimuth of the drilling system in 300°C environments. The DM300 module utilizes high-temperature electronics designed and fabricated using the Honeywell HTSOI4TM silicon-on-insulator process. A family of chips supporting the DM300 development have been fabricated and tested demonstrating excellent performance up to 300°C temperatures. Ceramic substrates have been designed and fabricated to incorporate the electronic chips with passive components, connectors and hybrid covers. Several of these high-temperature circuit hybrid assemblies are housed alongside flux-gate magnetometer sensors and silicon-based MEMS accelerometers in a small diameter, <1.25”, titanium chassis. Module prototypes have been fabricated, assembled, and tested demonstrating the functionality of the accelerometer and magnetometer sensor, and electronics at 300°C. The module provides logic-level frequency output signals where the frequency is proportional to the sensed input. The module output includes a temperature sensor signal in frequency mode. The DM300 is capable of transmitting the frequency signal outputs over long transmission lines. This paper contains information on the target application, component requirements, design, and fabrication approach. This material is based upon work supported by the U.S. Department of Energy under, Golden Field Office, award number DE-EE0002574.
Douglas C. MacGugan, Staff Engineer
Honeywell Aerospace
Redmond, WA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems