Micross

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Here is the abstract you requested from the HiTEN_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

DIP Test Socket Characterization for 300ºC
Keywords: Test, High Temperature, Reliability
Testing of SiC devices or prototype circuits for reliability at 300C requires that the test fixtures have better reliability. Fabrication and testing of a prototype test board using commercially available BeNi contacts shows resistance stability beyond 2000 hours. The fabrication process and applications of the test board are presented.
David Shaddock,
General Electric Global Research
Niskayuna, NY
USA


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