Device Packaging 2019

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DIP Test Socket Characterization for 300ºC
Keywords: Test, High Temperature, Reliability
Testing of SiC devices or prototype circuits for reliability at 300C requires that the test fixtures have better reliability. Fabrication and testing of a prototype test board using commercially available BeNi contacts shows resistance stability beyond 2000 hours. The fabrication process and applications of the test board are presented.
David Shaddock,
General Electric Global Research
Niskayuna, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic