Device Packaging 2019

Abstract Preview

Here is the abstract you requested from the HiTEN_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

KEMET SMD Film Capacitors for high Temperature applications
Keywords: Film, Down-hole, Temperature
Trends of several applications like Down-hole Drilling, Commercial Aviation (e.g. Jet Engines), Heavy Industrial and Automotive are challenging the capabilities of capacitors and other electronic components. The growing harsh environment conditions for these applications are: high Temperature, high Voltage and high Current. At the capacitor component level, required features are: very high Reliability under mechanical Shock and Vibration, Rapid Changes in Temperature, low Leakage Current (high insulation resistance), small Dimensions, good stability with time and humidity, and high peak withstanding voltage. Capacitors for power-conversion circuitry must maintain a low ac loss and dc leakage at high temperature. KEMET has recently designed film capacitor series using PEN to address the needs of the above mentioned circuits, in particular regarding the working Temperature, Voltage and Current. This paper will cover technological advances in film capacitor technology to address Harsh Environment conditions needs and will present the Reliability and Failure mechanisms analysis, with the Test results consideration of the Temperature, Voltage, Relative Humidity and Thermal Shock acceleration factor.
Luca Caliari, Technical Engineer
KEMET Electronics Corporation
Sasso Marconi, BOLOGNA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic