Device Packaging 2019

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Sensor Interface Applications for High Temperature Precision Amplifiers
Keywords: Low Offset and Low Noise, high temperature electronics, Transimpedance Amplifiers
This paper will present the electrical performances of a new high temperature low-noise low-offset amplifier developed for high precision signal conditioning, in particular for sensor interfaces and instrumentation amplifiers. Electrical characterization of this amplifier from -55C up to 225C will be presented and discussed: in particular the low input voltage offset, lower than 50uV, and the low input integrated noise, down to 1uVpp integrated from 0.1Hz to 10Hz. The amplifier has a typical gain bandwidth product of 2.8MHz. It also features high CMRR (>80dB), input and output rail-to-rail voltage swing as well as low input (<50nA), stand-by (7uA) and quiescent currents (<2mA) at high temperature. To answer to the strong requirements in terms of size of sensor interface applications, the chip has been optimized to fit a dual amplifier in a tiny hermetically sealed Ceramic SMD package (5mmx5.5mm). Emphasis will be put on the applications of this precision amplifier in sensor interface circuits: e.g. instrumentation amplifiers for sensor capacitor or resistor bridges, low input current transimpedance amplifiers or 4-20mA current-loop transmitters. Hands-on board-level reference design for reliable operation up to 225C will be presented.
Pierre Delatte,
Mont-Saint-Guibert, B

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