Micross

Abstract Preview

Here is the abstract you requested from the HiTEN_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures
Keywords: High Temperature electronics, LED lighting, component design
Due to superior properties in energy-efficiency and design freedom, the “liberation of light” by LED-technology will draw more attention in future applications. Together with their partners in the European SEEL project, NXP is performing research in enabling technologies for high-temperature electronics to be designed into the next generation of high-efficient LED-driver circuits. This requires high-temperature evaluation of the product architecture, i.e. the 1st-level interconnection (metallisation, bonding), the material & electrical properties of the semiconductor components and packages as well as the board mounting architectures, i.e. interconnection technologies and board materials, of the products. The current status of the project as well as the future exploitation outlook will be presented.
Soenke Habenicht,
NXP Semiconductors Germany
Hamburg, Hamburg
Germany


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems