Device Packaging 2019

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Lead-free Solder Attach for 200oC Applications
Keywords: Solder alloy, High temperature, Die Attach
Conventional lead-free solders have a melting point of 217oC to 227oC limiting their suitability for applications at 200oC. A new AgBiX solder has been introduced with a potential for 200oC applications. This paper will examine the processing, microstructure and reliability (200oC storage and -55oC to 200oC thermal cycling) of this alloy for component attachment.
Wayne Johnson, Professor and Chair
Tennessee Technological University
Cookeville, TN

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic