Device Packaging 2019

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Long-Term Demonstrated Reliability of Improved High Temperature Ceramic Chip Capacitors for Use in Extreme, Harsh Environments
Keywords: High Temperature, Capacitors, Reliability
Availability of a reliable and consistent source for high temperature ceramic capacitors has been an ongoing issue for design engineers looking at developing product for applications up to and including +300°C. The general practice has been to derate standard X7R ceramic capacitors for high temperature applications and settle for a device characterized by a significant reduction in those critical performance features related to capacitance value, operating voltage, insulation resistance and breakdown voltage, not to mention a substantial roll off in temperature coefficient above +150°C. In addition, the need to provide coated and / or leaded options also presents additional concerns related to operational integrity. This paper presents packaging options, life test reliability data and compares performance characteristics for a unique high K, high temperature ceramic capacitor, to the more traditional options. This approach utilizes leading edge, Class II dielectric and packaging materials that have been specifically developed for use at +300°C and then benefit from enhanced reliability when operated at lower temperatures. As shown in this paper, capacitors manufactured with this dielectric material exhibit much higher capacitance per unit volume and significant improvements in insulation resistance, without having to sacrifice mechanical strength, voltage rating or long term reliability.
Mustafa A. Syammach, PRESIDENT/CEO

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic