Device Packaging 2019

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High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices
Keywords: Semiconductor Technologies, Reliability, Extreme Temperatures
An increasing number of extreme temperature operating applications require temperatures that can range from -650C to 3000C, driving semiconductor suppliers to innovate new analog, digital, and mixed-signal solutions based on technologies including SiC, Si, SOI and CMOS. This paper will address industry needs including performance parameters and processes currently in development for analog, digital, and mixed-signal productions. In addition, the paper will highlight Microsemi’s real-world results including characterization and reliability data on discrete power products including diodes and bridge rectifiers, and integrated circuits including FPGAs for demanding applications including down-hole drilling, commercial aviation, power sub-systems and power distribution in military vehicles.
Brian Wilkinson, Director Strategic Applications HRG
Ennis, Clare

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic