Here is the abstract you requested from the HiTEN_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices|
|Keywords: Semiconductor Technologies, Reliability, Extreme Temperatures|
|An increasing number of extreme temperature operating applications require temperatures that can range from -650C to 3000C, driving semiconductor suppliers to innovate new analog, digital, and mixed-signal solutions based on technologies including SiC, Si, SOI and CMOS. This paper will address industry needs including performance parameters and processes currently in development for analog, digital, and mixed-signal productions. In addition, the paper will highlight Microsemi’s real-world results including characterization and reliability data on discrete power products including diodes and bridge rectifiers, and integrated circuits including FPGAs for demanding applications including down-hole drilling, commercial aviation, power sub-systems and power distribution in military vehicles.|
|Brian Wilkinson, Director Strategic Applications HRG