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Automated Wirebond Pull Testing - Parallelogram of Forces-Real time Application
Keywords: Wire bond, Pull testing, wire
In hybrid electronics it is a standard practice to perform 100% wirebond pull testing to ensure robust wirebonding of the components. The principle behind basic wire bond pull testing in compliance to the standards laid out in Mil-STD-883 method 2023.5 is to position the hook underneath the wire and either pulling until the wire breaks or, alternatively, pull to a predefined force. With high density components and small geometry (e.g. Ultrafine Pitch and/or with staggered wirebonds) it has been a challenge for the manufacturing operations to maintain consistency in “manually” placing the wirepull hook on wires with varying height, looping profiles and wire length, or distances. The influence of loop height and wire distance plays a big factor in determining the true wire pull strength. A low wire loop will result in a lower measured pull strength, while a higher loop will result in a higher pull strength. Therefore, if we can accurately quantify the loop height and profile then we can place the wire pull hook in the optimum position for pulling. In this study we will demonstrate how the
Richard C. Garcia, Sr. Manufacturing Engineer
Crane Aerospace
Redmond, WA
USA


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