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Isothermal Fatigue Tests of Sn63-Pb37,Sn62-Pb36-Ag2 and Sn42-Bi58 Solder Joints
Keywords: isothermal fatigue, tin alloys, bismuth
Solder alloys like Sn63-Pb37 and Sn62-Pb36-Ag2 are commonly used in surface mounted components (SMT) for electronic equipment those require high reliability. Lead presents high toxicity and it was eliminated in some electronic components soldering process. The objective of this research is to characterize and analyze the isothermal fatigue strength of copper joints soldered with Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 solder alloys commercially available. The samples were submitted to isothermal fatigue tests and were made up of two copper wires with a 1.6mm diameter soldered at the top (butt joint). The statistical method used to obtain and analyze the experimental data of the isothermal fatigue test was the staircase method. The obtained value for mean fatigue strength for the soldered joints with Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 were 34 +/- 5 MPa, 38 +/- 2 MPa and 37 +/- 6 MPa respectively. The experimental fatigue tests results, the fractography of Sn-Pb fracture surfaces, different kind of ruptures obtained to Sn-Pb soldered joints and microstructures of tin-lead and lead-free solder alloys are presented.
Eliane M Grigoletto, Professor
UNISAL College
Campinas, Sao Paulo
Brazil


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