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Thermal Evaluation of High-Current Polyimide Rigid and Rigid-Flex Printed Circuit Board Trace Widths in Vacuum Pressure Environments
Keywords: High current, Trace width, Temperature rise
This paper details the thermal evaluation of a high-power polyimide rigid and rigid-flex printed wiring board (PWB) in vacuum pressure environments. Although industry standards, such as IPC-2152 or MIL-STD-275, can be used to determine trace width for PWB traces that carry current to between 20 or 30 amps for multiple copper plane thicknesses, they typically cannot be used to determine trace width for PWB traces that handle current greater than 30 amps. This paper presents results from analysis and testing of a high-power rigid and rigid-flex PWB that must carry current of up to 60 amps. Testing was performed in vacuum pressure environments, measuring board temperature at specific locations to determine performance of different trace widths using 2 and 4 ounce copper layers. A thermal imaging camera was used to identify PWB hot spots
Bennion Cannon,
Glendale, AZ

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic