Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Multi Beam Low-K Grooving Evaluation of various removal principals-ALSI-Abstract IMAPS 2013|
|Keywords: Laser, dicing, low-K|
|Since main stream wafer technologies are well below the 90nm node and low-K materials were inevitable it has become clear that sole blade dicing evolution is coming to an end. Low-K removal through a laser process has been introduced and became a process of reference. A design rule for various semiconductor manufacturers is that all wafers below 45nm require a low-K laser grooving process. In accordance with more of Moore’s law the ever increasing miniaturization is requiring increased capability for the (ultra) low-K grooving of IC wafers. The growing capacity requirement forces the industry to look for inventive ways increasing the productivity for such processes and reduce the Cost of Ownership. The presentation will address how the multi beam laser grooving process is an enabling technology that allows semiconductor manufacturers to execute their technology roadmap and continue to comply with Moore’s law in a cost efficient manner. This presentation will address in depth, the challenges and issue’s that semiconductor manufacturers are facing with respect to the dicing of (ultra) low-K IC wafers. Main challenges are the ability to dice through a fragile and brittle stack of passivations, low-k materials, and multiple metal structures. This paper will also address the various options to define the low-K grooving process (modification depth, removal depth) and reveal a comparison study between various removal methods (single beam vs. multi beam). The presentation will disclose how a multi beam process will play a dominant role in achieving an extremely small Heat Affected Zone combined with a significantly higher productivity. It will be demonstrated how a unique combination and optimization of multiple beams, pulse duration, and low pulse energy, can meet the challenging requirements set by the industry. In addition dicing results and achieved productivities will be presented.|
|Jeroen van Borkulo, Customer Application Manager
Advanced Laser Separation International (ALSI) N.V.
Beuningen, Not Applicable