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A Solder Joint Reliability Model for the Philips Lumileds LUXEON Rebel LED Carrier Using Physics of Failure Methodology
Keywords: Solder Joint Reliability, LED, Physics of Failure
LEDs are quickly evolving as the dominant lighting solution for a wide variety of applications. With the elimination of incandescent light bulbs and the toxic limitations of fluorescent bulbs, there has been a dramatic increase in the interest in high-brightness light emitting diodes (HB-LEDs). Getting the light out of the die, with reliable color, while maintaining appropriate thermal control over a long service life is a challenge. These issues must be understood and achieved to meet the needs of unique applications, such as solid-state-lighting, automotive, signage, and medical applications. These applications have requirements for 15-25 years of operation making their reliability of critical importance. Philips Lumileds, in conjunction with DfR Solutions, developed reliability models for the LUXEON Rebel LED carrier series with respect to multiple circuit board construction types and material sets. Solder fatigue lifetime was predicted based on strain energy calculations. Finite element models were developed to calculate shear stress and strain range. Temperature cycling of the different material sets was performed to validate the models. The experimental results were integrated in DfR’s Automated Design Analysis™ software to ascertain the Physics of Failure (PoF) based reliability predictions for the LEDs. In this paper, the model development methodology and validation approach will be described. Additionally, the Philips Lumileds tool used to demonstrate the long term reliability characteristics of their LEDs to customers will be presented.
Greg Caswell, Sr. Member of the Technical Staff
DfR Solutions
Beltsville, MD
USA


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