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Moisture and Hydrogen release in optoelectronics hermetic packages.
Keywords: Hermeticity, Moisture, Hydrogen
The effects of the Ni plating process, pre-baking, and Au thickness on the moisture and hydrogen content of hermetic packages have been investigated. While baking the package components before sealing was observed to alleviate the problem of moisture formation inside the package, it doesn’t fully eliminate it. It was only after changing the Ni plating process from electroless to electrolytic that the moisture problem actually disappeared. Our investigation showed that moisture formation inside hermetic packages is due to H evolution from the electroless Ni which eventually reacts with surface oxides to form H2O. SIMS analysis of electroless Ni indicated that electroless Ni is richer in H compared to it is electrolytic counterpart. Surface analysis also showed that the grain size of the E-less Ni is finer than that of the E-lytic Ni which makes H out-diffusion in E-less Ni faster and easier.
Marwan Albarghouti, Sr Reliability Engineer
Semtech
Kanata, ON
Canada


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