Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process|
|Keywords: 3D-IC, Pre-applied , High Thermal|
|For the purpose of high performance and low power, three dimensional (3D) IC has been proposed in recent years. Due to the narrow gap and fine pitch of substrate, high thermal conductive inter chip fill (HT-ICF) which can be used for pre-applied process is strongly required and thermal conductive materials and highly active flux have been called for at same time. In this study, some kind of materials were prepared and optimized for high thermal ICF, and we evaluated its characteristic and confirmed applicability to pre-applied joining for 3D-IC.|
|Yasuhiro Kawase, Chief Researcher
Mitsubishi Chemical Corporation, Kurosaki Plant R&D Center