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Compression molding solutions for various high end Package and Cost savings for standard Package applications
Keywords: compression molding, mems packaging, thin packages
Introduction There have been substantial changes on sensitive IC such as 2.5D, 3D and MEMS packages to prebentive break silicon chips by packing pressure and high density IC packages. Packages are becoming smaller, thinner and weaker but, more numbers of chips are installed and stacked and bump height for flip chip are becoming thinner and wires are becoming longer and finer. Towa has been proving mold solutions for IC packages based on their original innovative Multi-Plunger molding method. Recently, Transfer Molding method is facing difficulty to mold advanced packages such as multi-stack die which 2.5D, 3D and MEMS and fine wire bonded packages. Transfer molding requires resin flow path with high injection pressure to fill in the cavity using thermoset compound. The advanced packages have limited space for resin flow and more numbers of longer and finer wires are inside. Also, it becomes more difficult to mold large wafer and large area size substrate (Panel Mold) by Transfer molding method. To slove these issues, Compression MoldingPat.P was introduced which has become new Defacto standard. We have found that there are the following significant advantages by Compression Molding. 1. No mold cleaning Every after shot, no mold cleaning process is required because compound never touches mold cavity surface. Melamine mold cleaning is not required which will reduce scheduled Down Time and minimize cleaning material costs. 2. High effective usages of mold compound There is no wastage of mold compound as the required amount of compound is supplied and molded without any cull and runners. It is good for the ecology also. 3. High quality molding This method is quite suitable for the following advanced packages without having any internal defects: a.2.5D, 3D(TSV), MEMS package Thinner and weaker chips less than 28-Nano process with thin package thickness is destroyed by transfer high packing pressure minimum 70kg/cm2 to eliminate voids by creating during mold flow and gas from melted mold compounds.
Muneo Miura, Mold engineering, Sales and Marketing Dept.
Towa Corporation, Kyoto, Japan
Kyoto, Japan

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