Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Plating reliability and high frequency testing of DuPont™ GreenTape™ 9K7 LTCC|
|Keywords: LTCC, Electroless plating, GreenTape(tm)|
|Abstract Low Temperature Co-fired Ceramic (LTCC) with low dielectric loss is suitable for use on microwave and millimeter wave circuits. Thick film gold or silver conductors are used as metallization on LTCC substrates. Gold prices are increasing at a rapid rate, so efforts were made to lower the dependency on gold by substituting silver with Ni/Au surface finishes as top conductor. The external thick film silver conductors were plated using a standard Electroless Nickel Immersion Gold (ENIG) processes. The Ni/Au surface finishes provides substantial improvement to fretting corrosion, environmental protection, contact resistance, wire bond strengths, solder ability and solder joint reliability. The reliability testing of DuPont™ GreenTape™ 9K7 LTCC with Ni/Au surface finishes are being conducted. The reliability test methods & conditions were chosen from a well-established industry standard test protocols. This paper reports the reliability and high frequency testing results on ENIG plated GreenTape™ 9K7 LTCC system. Key words: LTCC, Electroless plating, GreenTape™ 9K7.|
|Allan Beikmohamadi, Research Associate