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|Frontend-ization of the Back-End|
|Keywords: TSV process, Advanced packaging process, TSV equipment|
|Frontend-ization of the Back-End Message:The trend towards 3D stacking and advanced packaging has significantly altered the requirements for manufacturing tools in the back-end. Techniques and processes being adopted are beginning to resemble the front-end of 20 years ago but with updated and more affordable cost-of ownership capabilities. As an example, 0.5um defect inspection would have been considered a front-end requirement 20 years ago. Today TSV and advanced packaging techniques such as fine-pitch RDL are demanding 0.5u level inspection but at perhaps 10x improvement in wafer throughput and 20x improvement in COO. Other Front-end capabilities ranging from metrology to Advanced Process Control (APC) that are being adopted by the back-end will also be discussed.|
|Rajiv Roy, VP. Business Development