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Electromigration in Pb – Free Solder: A Power IC Perspective
Keywords: Electromigration, Power IC's, Pb - Free
Over the last few years, Pb-free solder interconnects have been significantly incorporated into electronic products, and are increasingly found in high performance computing systems and in power electronics. As power and current levels increase, the overall reliability of a Pb-free solder based product can be impacted by an increasing risk of finding electromigration (EM) degradation during the product lifetime, especially if operating at higher temperatures and with very high current densities. This presentation will provide a high-level technical overview of Pb-free electromigration and describe the key factors and issues that can influence the EM performance of Pb-free interconnects, especially in power packaging environments
Tom Wassick, Senior Technical Staff Member
IBM Systems and Technology Group
Hopewell Jct, NY

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