Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Electromigration in Pb – Free Solder: A Power IC Perspective|
|Keywords: Electromigration, Power IC's, Pb - Free|
|Over the last few years, Pb-free solder interconnects have been significantly incorporated into electronic products, and are increasingly found in high performance computing systems and in power electronics. As power and current levels increase, the overall reliability of a Pb-free solder based product can be impacted by an increasing risk of finding electromigration (EM) degradation during the product lifetime, especially if operating at higher temperatures and with very high current densities. This presentation will provide a high-level technical overview of Pb-free electromigration and describe the key factors and issues that can influence the EM performance of Pb-free interconnects, especially in power packaging environments|
|Tom Wassick, Senior Technical Staff Member
IBM Systems and Technology Group
Hopewell Jct, NY