Abstract Preview

Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Influence of inorganic additives on rheology and properties of thick film pastes for AlN
Keywords: aluminium nitride, thick film paste, paste rheology
New conductor pastes for AlN as substrate material with fired films of a sheet resistance below 25 mOhm/sq were investigated. The pastes consist of AgPd as conductive phase for acid and leach resistance. Other paste ingredients are glasses of matched composition, little amounts of inorganic additives and organic vehicles as well as plasticisers. The latter has a significant influence on the paste deposition and the resulting film properties. In order to shine light into these relation systematic rheological studies of plasticisers and the manufactured pastes were performed. The rheological investigations include measurements in rheological equivalent as well as dynamic experiments of the polymer solution and the manufactured thick film paste. In addition, the solder and bond properties of the fired film were studied. FESEM analysis of the film structures were carried out in order to formulate structure-performance relations. The obtained results are discussed and conclusions are draw to aid improvements in the development of high performance thick film pastes.
Richard Schmidt, Research Assistant
Fraunhofer IKTS
Dresden, Saxony

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic