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Evaluation of Thermal Performance for a New Ventilated Heat Sink Module
Keywords: Heat dissipations, Thermal management, cooling device
Heat sink, lately regarded to as a cooling device, is broadly applied to reduce thermal intensity existing in electronic or LED applications. Typically, heat sink is designed to increase the surface area to enhance its capacity on heat dissipations, since it uses conduction to transfer thermal load from heat source and then exchange heat into air to attain the reduction of temperature. However, the high powered heat load cannot be effectively dissipated by such the genetic design. This paper introduces a new ventilated heat sink module which involves ventilations into the conventional heat sink model to increase the velocity of air flow and results in more heat load dissipated, effectively. Based on the law of conservation of energy, a fluid flowing from a wider region into a smaller region yields the increase in speed. Therefore, the described module with proper vent design is able to promptly remove hot air and cool the device quickly. This work applies commercial package ANSYS Icepak to investigate thermal performance of the described heat sink module. The present module contains three layers formed by a base plate and two level plates. The two level plates are vertically supported by fins whose spacing is 4mm. Vents are placed on each of two level plates and sided walls. Applying the described heat sink module on a LED application, numerical results indicate that the temperature approaching to the heat source can be reduced from 83°C to 77°C; moreover, at the location away from heat source farther, the reduction of temperature can attain approximately 23°C, from 79°C to 56°C. Modeling results demonstrates the validity of the described heat sink module on the heat dissipation, effectively.
Shiang-Jiun Lin,
National Kaohsiung University of Applied Sciences
Kaohsiung, N/A

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