Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|RF Capacitor Material for Use in PCBs|
|Keywords: RF Capacitor, Low loss, dc field strength|
|A novel organic-based RF capacitor material for the use either in discrete elements on the circuit board or in being embedded within the substrate for high frequency circuit applications has been developed to compete with ceramic-based capacitor material. This material provides the desired properties such as low loss at high frequencies (about 0.002 or less up to 10GHz) and high dc field strength (the electric field applied across the dielectric layer in RF capacitor), among other improved properties. The electrical properties were influenced significantly by the filler materials (type, particle size and distribution in the polymer matrix system). Their contributions to the dc field strength and temperature stability of capacitance (which is an important material issue for practical device application) will be discussed. In addition, capacitance tolerance for manufacturing embedded capacitors will be presented in terms of etching uniformity to minimize the variation of the capacitor electrode areas.|
|Jin-Hyun Hwang, R&D Manager
Oak-Mitsui Technologies, LLC
Hoosick Falls, NY