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A detailed analysis of how the power stage and power clip family achieves optimized power density
Keywords: power supply density, power supply efficiency, thermal impedance
Power density (A/sq mm) is an important metric in device selection for a power supply designer. A fundamental trend now occurring in high density power design is the move from discrete FETs to multi chip modules. The power stage (5 mm x 6 mm) and power clip (3.3 mm x 3.3 mm) family of asymmetrical dual MOSFETs has been optimized for power density for the typical synchronous buck regulator load. This paper presents a detailed analysis of how the power stage and power clip family achieved this performance.
Arthur Black, Applications Manager
Fairchild Semiconductor
San Jose, California
USA


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