Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A detailed analysis of how the power stage and power clip family achieves optimized power density|
|Keywords: power supply density, power supply efficiency, thermal impedance|
|Power density (A/sq mm) is an important metric in device selection for a power supply designer. A fundamental trend now occurring in high density power design is the move from discrete FETs to multi chip modules. The power stage (5 mm x 6 mm) and power clip (3.3 mm x 3.3 mm) family of asymmetrical dual MOSFETs has been optimized for power density for the typical synchronous buck regulator load. This paper presents a detailed analysis of how the power stage and power clip family achieved this performance.|
|Arthur Black, Applications Manager
San Jose, California