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Advanced Devices and Packaging for Harsh Environment Operation
Keywords: Harsh Environment, power module, reliability testing
Applications with extreme environment designate extreme temperature due to heat generated during operation and ambient temperature, HEV/PHEV applications – ideally sharing a coolant between the engine and the power electronics, junction temperature of power module with shared coolant ~200°C, thermal electric devices, integrated into the exhaust system, and the objective to take advantage of high temperatures devices. The work includes a typical structure of a power module comprising of devices to provide the electrical desired function, wirebonds for interconnection on the top surface terminals of the devices, encapsulation and housing to prevent arcing in air due to high voltages, and protection of the devices, prevention of oxidation and sublimation of thermoelectric materials, substrates to provide the interconnections to complete the circuit, and the base plate- metal plate to provide support and attachment method. The paper addresses the following challenges in high temperature packaging based on experimental work of the researchers and conducted reliability testing; die attach (high reflow temperature, low void fraction, low modulus of elasticity), wirebonding (formation of intermetallics, shape of wirebonds, diameter and number of wires), substrates, including direct bonded copper, direct bond aluminum, and active metal bonding (high electrical conductivity, low thermal resistance, high mechanical strength), and encapsulation (high operating temperature, high breakdown voltage, low modulus of elasticity).
Aicha Elshabini , Distinguished Professor
University of Idaho
Moscow, ID

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