Abstract Preview

Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Package and Assembly Considerations for Microfluidic Devices
Keywords: Assembly technologies, Microfluidics, Design
Microelectronic technology has enabled significant advances in a variety of fluidic applications that have historically used more traditional technologies. These advances bring cost reductions, improved performance and smaller size to a variety of product applications such genome sequencing, fuel cells and water quality sensing (1). Whether one-time use packages or packages for longer term use, the package design and assembly process along with the requisite material choices contribute significantly to the cost, performance, usability, reliability and aesthetics of the microfluidic device. Encapsulation, sealing, and fluidic interfaces always present challenges and material and assembly solutions will be shown that allowed the devices in the case studies to be qualified and placed into production. This paper will detail the practical requirements of microfluidic packages and highlight solutions to the unique challenges these types of devices present. Specifically, real-life case studies will be presented to highlight the following topics: • Fuel cell package case studies will highlight issues related to hermeticity, material selection and long-term reliability. • Gene sequencing case studies will highlight electrical and fluidic interface issues in disposable packages and the optical requirement that are often present (2) • Water quality sensor case studies will be used to analyze disposable, one-time-use package strategies and the practical and functional challenges of using these devices in the field (3). Throughout the case studies, issues associated with fluidic and electronic interfaces, the incorporation and isolation of electronic circuitry, material compatibility, reliability, manufacturability, cost and the influence of the package and assembly process on device performance will be highlighted.
Leland ,
Aspen Microsystems
Manitou Springs, Colorado

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic