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An analysis of package reliability testing challenges and solutions for wireless applications
Keywords: Reliability, Statistical Analysis, Wireless
Increased demands on time to market and new technology introductions create challenges for package reliability testing to be as efficient and comprehensive as possible within a limited time frame. Further, new package technologies and their interactions pose additional reliability risk with the need to be carefully evaluated. This paper will analyze this trend and identify solutions in the form of better and more efficient upfront methodologies such as potential problem analysis, delta analysis, detailed statistical analysis, and daisy chain/ test to failure methodologies. Future trends will also be evaluated. Outline • Technology Interactions • New emphasis on PPA • Delta analysis • Detailed Statistical Analysis • Daisy Chains • Importance of up front testing • Cost and Time • Working together • Future Trends
Michael Ferrara, Staff Reliability Engineer
Greensboro, NC

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic