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|Packaging of 1.3 Tbs Full Duplex Optical Interconnect|
|Keywords: Optical Interconnect, Electro-Optical Packaging, Flip-Chip|
|The electro-optical packaging process of an icPhotonics device is described. The icPhotonics device has an aggregate full duplex bandwidth of 1.3 Tb/s using a bandwidth density of 64Gb/s/mm2. The optical interconnect is assembled using an organic substrate, ASIC die, vertical-cavity surface-emitting laser (VCSEL) matrix, Photo-diode (PD) matrix and 2 micro-lens-arrays (MLA's). In addition, the data is transmitted to and from a specially designed fiber-bundle through a second set of MLA's. Each optical device consists of a 12 X 14 matrix array, where each link transmits and receives in 8 Gb/s – totaling to a 1.344 Tb/s full duplex in each optical interconnect module. Packaging steps use five different flip-chip and reflow or glue steps – thus maximizing module density. The optical fiber-bundle assembly is performed after the printed-circuit-board is populated, and thus completes a full optical-interconnect. Reliability studies had been performed successfully for the entire assembly. The optical-interconnect modules are routinely fabricated in a small series production scale and used as a crucial building block, creating a full mesh optical link between different line-cards and racks in Compass-EOS core-router system.|
|Shuki Benjamin, Manager, Process Engineering