Abstract Preview

Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

3D Integration of System-in-Package (SiP) Using Organic Interposers: Toward SiP-Interposer-SiP for High-End Electronics
Keywords: 3D Integration, SiP, Organic Interposer
The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate multiple substrates, multiple dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. The approaches explored in this paper include eliminating active chip packages by directly attaching the chip to the System-in-Package (SiP) with flip chip technology. Additionally, the area devoted to passive components can be greatly reduced by embedding many of the capacitors and resistors. In some instances, the connector systems that were consuming large amounts of space in the traditional Printed Wiring Board (PWB) assembly can be reduced with a small pitch connector system. This PWB assembly can then be transformed into a much smaller SiP with the full surface area on both sides of the package effectively utilized by active and passive components. The miniaturized SiP with its reduced package size and demand for passives requires a high wireability package with embedded passives and excellent communication from top to bottom. In the present study, we also report novel 3D “Package Interposer Package” (PIP) solution for combining multiple SiP substrates into a single package. A variety of organic interposer structures were used to fabricate SiP-Interposer-SiP modules. Electrical connections were formed during reflow using a tin-lead eutectic solder paste. Interconnection among substrates (packages) in the stack was achieved using interposers. Plated through holes in the interposers, formed by laser or mechanical drilling and having diameters ranging from 50 m to 250 m, were filled with an electrically conductive adhesive and cured. The adhesive-filled and cured interposers were reflowed with circuitized substrates to produce a PIP structure. In summary, the present work describes an integrated approach to develop 3D PIP solutions on various SiP configurations.
Rabindra Das, Principal Engineer
Endicott Interconnect Technologies, Inc.
Endicott, New York

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic