Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A NOVEL HIGH THERMAL CONDUCTIVE UNDERFILL FOR FLIP CHIP APPLICATION|
|Keywords: underfill, flip chip, high thermal conductivity|
|Silica dioxide is nromally used as filler in underfill, and the thermally conductivity of underfill is less than 1 w/mk which is not able to meet the current flip chip application such as 3D stacked multi-chips package. No matter which directrion the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductvity of underfill cab signifigantly enhance the reliability of electronic device, particularly in 3D package devices. YINCAE Advanced Materials, LLC has developed a novel high thermal conductive underfill for flip chip application. Using Aluminum nitirde, diamond powder or carbon nanotuble as filler in underfill, the thermal conductivity has been increased many times ( up to 5w/mk) which can greatly reduce the thermal stress for solder joint. The flowability, adhesion and other properties of underfill have been characterized and investigated. All detail will be discussed in this paper.|
YINCAE Advanced Materials, LLC