Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Solder Joint Encapsulant Adhesive – LGA High Reliability And Low Cost Assembly Solution|
|Keywords: Solder joint encapsulant, Land grid array, pin transfer process|
|More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT 256 has been successfully used for LGA assembly by using pin transfer process. Solder joint encapsulant is used in in-line LGA soldering process with enhancing reliability. It eliminates the underfilling process and provides excellent reworkability. The shear strength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. All details such as assembly process, drop test and thermal cycling test will be discussed in the full paper.|
YINCAE Advanced Materials, LLC