Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra-High and Moderate-Level Vacuum Packaging of Vibratory MEMS|
|Keywords: MEMS gyroscope, packaging, quality factor|
|We report vacuum packaging procedures for low-stress die attachment and versatile hermetic sealing of resonant MEMS. The developed in-house infrastructure allows for both ultra-high and moderate-level vacuum packaging addressing the requirements of various applications. Prototypes of 100 m silicon-on-insulator Quadruple Mass Gyroscopes (QMGs) were packaged using the developed process with and without getters. Characterization of stand-alone packaged devices with no getters resulted in stable quality factors (Q-factors) of 1000 (corresponding to 0.5 Torr vacuum level), while devices sealed with getter activation demonstrated Q-factors of 1.2 million (below 0.1 mTorr level inside the package). Owing to high Q-factors, we project that the QMG used in this work can potentially reach the navigation-grade performance, potentially bringing the gap between the inertial silicon MEMS and the state-of-the-art fused quartz hemispherical resonator gyroscopes.|
|Igor P. Prikhodko, Research Assistant
University of California, Irvine