Micross

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Ultra-High and Moderate-Level Vacuum Packaging of Vibratory MEMS
Keywords: MEMS gyroscope, packaging, quality factor
We report vacuum packaging procedures for low-stress die attachment and versatile hermetic sealing of resonant MEMS. The developed in-house infrastructure allows for both ultra-high and moderate-level vacuum packaging addressing the requirements of various applications. Prototypes of 100 m silicon-on-insulator Quadruple Mass Gyroscopes (QMGs) were packaged using the developed process with and without getters. Characterization of stand-alone packaged devices with no getters resulted in stable quality factors (Q-factors) of 1000 (corresponding to 0.5 Torr vacuum level), while devices sealed with getter activation demonstrated Q-factors of 1.2 million (below 0.1 mTorr level inside the package). Owing to high Q-factors, we project that the QMG used in this work can potentially reach the navigation-grade performance, potentially bringing the gap between the inertial silicon MEMS and the state-of-the-art fused quartz hemispherical resonator gyroscopes.
Igor P. Prikhodko, Research Assistant
University of California, Irvine
Irvine, CA
USA


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