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Challenges of Adhesion Promotion for the Metallization of Glass Interposers
Keywords: Glass Interposers, Adhesion, 3D Integration
Ultra-miniaturization and 3D integration of electronic systems require interposers with a very high density of off-chip interconnections. Silicon and glass interposers are being developed widely to meet these needs. Through hole via formation or Through Package Via (TPV) in combination with the ability to handle of thin glass materials have already been demonstrated in combination with 'polymer on glass' technologies at Georgia Tech Packaging Research Center and by industrial partners. However there is an increasing industry demand to plate electroless copper directly onto smooth glass substrates which is extremely challenging. This is being driven by the desire to be able to benefit from the ability to utilize existing infrastructure and therefore fully benefit from the cost advantages wet-chemical metallization can offer in the manufacturing of glass interposers. It is therefore worthwhile to investigate replacing adhesion promoting techniques such as sputtered metal seed layers or laminated polymer films with a wet-chemistry alternative. In this study a modified sol gel process was developed for the formation of metal oxide layers on the glass substrate. The impact of the sol composition on the resulting oxide’s surface structure was examined. Centrifugal adhesion measurement allowed quantification of the mechanical anchoring provided by metal oxide layers prepared from different sol gel compositions. With regards to the interposer manufacturing process, the two possibilities of applying the sol gel coating prior to as well as after TPV formation are compared and their respective advantages are discussed.
Robin Taylor, Marketing and Technical Sales Manager
Atotech Deutschland GmbH
Berlin, D

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