Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Additive Manufacturing without Ink|
|Keywords: additive manufacturing, additive process, conducting lines|
|Advantech US has developed an additive process for manufacturing electronics that uses bulk materials without bulk materials. By using bulk materials such as copper, silver, gold, etc. the process is able to generate conducting lines and devices with the same electrical properties of traditional non-additive fabrication techniques without the added expense of making the material into an ink used by many other additive methods. The Advantech US process is capable of generating feature sizes to under 10 microns with registration to under 1 micron. This process has shown significant potential for the fabrication of chip packaging, microelectronic devices and circuitry; specifically, high density interposers, fine conductor lines and embedded components such as capacitors, resistors, and transistors. It has shown itself to be compatible with a number of both rigid and flexible substrates and many deposition materials.|
|Scott Lauer, Vice President, Product Development