Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|APPLICATION OF MOLDED UNDERFILL IN PACKAGING OF SMT MODULES|
|Keywords: molded underfill, epoxy mold compound, , modules encapsulant|
|System in a package (SIP) solutions are widespread in all sorts of electronic appliances and, in special, for wireless communications, due their convenience of integration different functionality (and silicon) into one single ‘package’. OEMs prefer them over single point solutions because they simplify their supply chain. But if SIP has helped consolidate the supply chain it hasn’t helped process engineers ; as these systems become more complex, with integration of different ICs, switches, diodes, resistors, capacitors, coils, etc. the challenges become varied and sometimes difficult to address. In this paper, we review some of the challenges we have faced in developing a SIP MUF solution, that is, modules which use a single encapsulation process : challenges, benefits and adoption rates.|